ࡱ;  A\pwwwadmin Ba==h\:#8X@"1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1Arial1 Arial"$"#,##0_);("$"#,##0)"$"#,##0_);[Red]("$"#,##0) "$"#,##0.00_);("$"#,##0.00)% "$"#,##0.00_);[Red]("$"#,##0.00),*'_(* #,##0_);_(* (#,##0);_(* "-"_);_(@_)5)0_("$"* #,##0_);_("$"* (#,##0);_("$"* "-"_);_(@_)=,8_("$"* #,##0.00_);_("$"* (#,##0.00);_("$"* "-"??_);_(@_)4+/_(* #,##0.00_);_(* (#,##0.00);_(* "-"??_);_(@_)                + ) , *     +    () *8  *  (8/   ()  (  (                  +    +    +  +  +  +     * `* `f* ff* fa* a* * *    `  `` f*  f` f* *     *      f    (    (              !+   *!  (!/       (       + * * *      (      (   !+  !  !+  !  ! `iAR0144CSSM00SUKA0-CPBR1ZR3 A@@    ;%dH@Ƶ5/9/2025 Base PartAR0144CSHFPb-freeOrderable PartAR0144CSSM00SUKA0-CPBR1Total weight (mg)Homogenous Material Weight (mg)Substance in Mat.CAS # % Avg. WeightDie Silicon (Si) 7440-21-3Glass Attach Epoxy Miscellaneous trade secretEpoxy Phenol Novolak Resin 28064-14-4Glass Lid /CapBoron Trioxide (B2O3) 1303-86-2Magnesium Monoxide (MgO) 1309-48-4Barium Monoxide (BaO) 1304-28-5Aluminum Trioxide (Al2O3) 1344-28-1Calcium Monoxide (CaO) 1305-78-8Silica Crystalline (SiO2) 14808-60-7Metal Shielding Copper (Cu) 7440-50-8 Aluminum (Al) 7429-90-5RDL Nickel (Ni) 7440-02-0 Gold (Au) 7440-57-5 Solder Ball Silver (Ag) 7440-22-4Tin (Sn) 7440-31-5Substrate and Solder Mask9-Phenylacridine602-56-22-Propenoic acid 1245638-61-23-Methoxy-1-butanol 2517-43-3$ Bisphenol A_Epichlorohydrin Polymer 25068-38-6 1-Methoxy-2-propyl acetate (MPA)108-65-6TOTAL4Materials Disclosure Disclaimer: Even though all possible efforts have been made to provide you with the most accurate information, we cannot guarantee to its accuracy since the data has been compiled based on the ranges provided, and some information provided by the subcontractors and raw material suppliers may have been withheld to protect their business proprietary information. Thus this information is provided only as estimates, and do not include trace levels fo dopants and metal materials contained within silicon devices in the finished products. There is no intentional use of RoHS restricted substances. Lead (Pb) and lead oxide (PbO) areexempted with the RoHS exemption 7(a), 7(c)and 15. For further explanation on material composition calculations, please view our Product Chemical Content Brochure at: 3/pub/Collateral/BRD8022-D.PDFB (q4}I2{   &!#  dMbP?_*+%"d,,??U} @} 9 } } }  &      [ NNN P \+ / / Q fg h ij|гYD@ ]    S ^:(~k @  TY@ _EQ|?  T*@ `D  TU@ _E~:p=@  T$@ aG  T@ aG   T@ aG   T$@ aG    T@ `D ! " T@P@ _# Eb=? $ % T? `D & 'TX@ _(E\m? ) *T33333N@ aG + ,THzG? aG $ %TRQ? `D & 'T(\B@ _-ENё\@ . /T@ aG 0 1T X@ `D $ %T? _2E rh?  T$@ aG 3 4T@ aG 5 6T$@ aG 7 8T9@ aG 9 :T9@ `D ; <T9@ b>!|гYD@ !!UcVcVcVD l,BFFNN<N<<<<<N<N<<<N<<N<<<<<0 !"#$% c V!c!V"c"V#c#V$dIIIWP%e:3/pub/Collateral/BRD8022-D.PDFBg%YYYZBdT<(  ~  <NUP@5%   ]4@   < Halogen Free< ~~  <@ !        $%% Root EntryWorkbook&