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УА УА УА УА УА УА `ЕюAR0330CM1C00SHAA0-DPМыZЁRЁ3 Ё┐БA└@@ё  ўо  ;1№╘`V├─╚╦╩╙╞╡5/9/2025 Base PartAR0330CMHFPb-freeOrderable PartAR0330CM1C00SHAA0-DPTotal weight (mg)Homogenous Material Weight (mg)Substance in Mat.CAS # % Avg. WeightCeramic Substrate Cobalt (Co) 7440-48-4Titanium Dioxide (TiO2) 13463-67-7 Tungsten (W) 7440-33-7Magnesium Monoxide (MgO) 1309-48-4Calcium Oxide (CaO) 60873-85-0Silica Amorphous (SiO2) 7631-86-9Aluminum Trioxide (Al2O3) 1344-28-1 Nickel (Ni) 7440-02-0 Gold (Au) 7440-57-5 Thallium (Tl) 82870-81-3Chromium Trioxide (Cr2O3) 1308-38-9DieMisc.proprietary data Silicon (Si) 7440-21-3 Aluminum (Al) 7429-90-5 Die Attach Silver (Ag) 7440-22-4 Epoxy resins 129915-35-1Acrylic resinsGamma-Butyrolactone96-48-0 Imaging LensSodium Monoxide (Na2O) 1313-59-3Boron Trioxide (B2O3) 1303-86-2Zinc Monoxide (ZnO) 1314-13-2Antimony Trioxide (Sb2O3) 1309-64-4Potassium Monoxide (K2O) 12136-45-7Silica Crystalline (SiO2) 14808-60-7 Lid AttachOther Additive AgentsPhotoinitiatorEpoxy Prepolymer Marking Ink$ Bisphenol A_Epichlorohydrin Polymer 25068-38-6 1-Methoxy-2-propyl acetate (MPA)108-65-6Butylglycol Acetate112-07-2Solvent Naphtha (Solvent oil) 64742-94-5 Cyclohexanone108-94-1Xylene 1330-20-7Wire Bond - AuTOTAL4Materials Disclosure Disclaimer: Even though all possible efforts have been made to provide you with the most accurate information, we cannot guarantee to its accuracy since the data has been compiled based on the ranges provided, and some information provided by the subcontractors and raw material suppliers may have been withheld to protect their business proprietary information. Thus this information is provided only as estimates, and do not include trace levels fo dopants and metal materials contained within silicon devices in the finished products. There is no intentional use of RoHS restricted substances. Lead (Pb) and lead oxide (PbO) areаexempted with the RoHS exemption 7(a), 7(c)аand 15. 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