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Integrated Driver & MOSFET | FDMF5085

Smart Power Stage (SPS) Modules with Integrated Current and Temperature Monitors

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Overview

The FDMF5085 is 媚人视频’s next generation Smart Power Stage (SPS) solution with fully optimized, ultra−compact, integrated MOSFETs with advanced driver IC current and temperature sensors, for high−current, high frequency, and synchronous buck DC−DC converters.
With an integrated approach, the SPS switching power stage is optimized for driver and MOSFET dynamic performance, system parasitic reduction, and power MOSFET RDS(ON).
The integration of Power MOSFETs with a driver IC also enables high accuracy module−level thermal and current monitoring. The FDMF5085 provides an output signal (IMON), which reports the real−time module current. The IMON signal can be used to replace inductor DCR current sense or resistor sense methods. There is also accurate thermal monitoring (TMON) that provides a 0.8 V output at 25°C with an 8 mV/°C slope.

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  • DC-DC Power Module

  • Server CPUs, Storage, Telecom
  • Artificial Intelligence Add-On Cards

  • 108 A Peak Current Limit Capability
  • High-Performance, Universal Footprint, Copper-Clip 5 mm x 6 mm PQFN Package
  • 媚人视频鈥檚 PowerTrench庐 MOSFETs for Clean Voltage Waveforms and Reduced Ringing
  • 30 V / 25 V Breakdown Voltage MOSFETs for Higher Long-Term Reliability
  • Optimized for Switching Frequencies up to 1 MHz
  • Optimized FET Pair for Highest Efficiency at 10% ~ 15 % Duty Cycle
  • Integrated Current Monitoring (IMON)
  • Integrated Temperature Monitor (TMON)
  • Catastrophic Fault Detection Features
  • Thermal Flag (OTP) for Over-Temperature Condition
  • Over-Current Protection Fault (OCP)
  • High-Side Short Detect Fault
  • Under-Voltage Lockout (UVLO) on VCC and PVCC
  • BOOT Under Voltage (BOOT UV)
  • 媚人视频 Green Packaging and RoHS Compliant
  • Dual Fault Pins (FAULT1, FAULT2) to Identify a Faulting Phase in Multi-phase Applications

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FDMF5085

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CAD Model

Pb

A

H

P

PQFN-39

483BF

1

260

REEL

3000

N

5

12

3.3V, 5V

108

1

$2.0666

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Reliability Data

Die Related Summary Data

Device: FDMF5085

Equivalent to wafer fab process: 29,RN

Product Technology

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Equivalent Device-Hours

MTBF/MTTF in Hours

FITS

29,RN

0

129145414

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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