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Silicon Photomultipliers (SiPM) | J-SERIES

Silicon Photomultiplier Sensors, J-Series (SiPM)

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Overview

ON Semiconductor's J-Series silicon photomultiplier (SiPM) sensors have been optimized for high-performance timing applications, such as ToF-PET (time of flight positron emission tomography). Due to increased microcell density, J-Series sensors can achieve a photon detection efficiency (PDE) of 50% and with sensitivity extending down into the UV. They feature industry-leading low dark count rates of 50 kHz/mm2 and because the sensors are created using a high-volume CMOS silicon process they feature an exceptional breakdown voltage uniformity of 卤250 mV.

J-Series sensors are available in 3 mm, 4 mm and 6 mm sizes packaged in a TSV chip scale package that is compatible with industry standard, lead-free, reflow soldering processes. J-Series sensors also feature ON Semiconductor's unique fast output for fast timing capability.

  • Medical Imaging
  • Hazard & Threat
  • 3D Ranging & Sensing
  • Biophotonics & Sciences
  • High Energy Physics

  • Positron Emission Tomography
  • Radiation Detection

  • High-density microcells
  • J-Series sensors feature ON Semiconductor's unique 'fast output' terminal
  • Temperature stability of 21.5 mV/掳C
  • Exceptional breakdown voltage uniformity of 卤250 mV
  • Available in a reflow solder compatible TSV chip-scale package
  • Ultra-low dark count rates of 50 kHz/mm2 typical
  • Optimized for high-performance timing applications, such as ToF-PET
  • 3 mm, 4 mm and 6 mm sensor sizes
  • Bias voltage of <30 V

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MICROFJ-30020-TSV-TR

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CAD Model

Pb

A

H

P

ODCSP-8

570CS

3

260

REEL

3000

Y

Single

~NA~

3 mm x 3 mm

20

420

38

50

Price N/A

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MICROFJ-30020-TSV-TR1

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CAD Model

Pb

A

H

P

ODCSP-8

570CS

4

260

REEL

1

Y

Single

~NA~

3 mm x 3 mm

20

420

38

50

Price N/A

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MICROFJ-30035-TSV-TR

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CAD Model

Pb

A

H

P

ODCSP-8

570CS

3

260

REEL

3000

Y

Single

~NA~

3 mm x 3 mm

35

420

50

50

Price N/A

More Details

MICROFJ-30035-TSV-TR1

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CAD Model

Pb

A

H

P

ODCSP-8

570CS

4

260

REEL

1

Y

Single

~NA~

3 mm x 3 mm

35

420

50

50

Price N/A

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MICROFJ-40035-TSV-TR

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Pb

A

H

P

ODCSP-16

570CN

3

260

REEL

3000

Y

Single

~NA~

4 mm x 4 mm

35

420

50

50

Price N/A

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MICROFJ-40035-TSV-TR1

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CAD Model

Pb

A

H

P

ODCSP-16

570CN

4

260

REEL

1

Y

Single

~NA~

4 mm x 4 mm

35

420

50

50

Price N/A

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MICROFJ-60035-TSV-TR

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CAD Model

Pb

A

H

P

ODCSP-36

570CP

3

260

REEL

3000

Y

Single

~NA~

6 mm x 6 mm

35

420

50

50

Price N/A

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MICROFJ-60035-TSV-TR1

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CAD Model

Pb

A

H

P

ODCSP-36

570CP

4

260

REEL

1

Y

Single

~NA~

6 mm x 6 mm

35

420

50

50

Price N/A

More Details

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Reliability Data

Die Related Summary Data

Device: MICROFJ-30020-TSV-TR

Equivalent to wafer fab process: CMOS SUB

Product Technology

Product Technology

Equivalent Device-Hours

MTBF/MTTF in Hours

FITS

CMOS SUB

2

920154574

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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