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Level Translators | FXL2TD245

Low Voltage Dual Supply 2-Bit Signal Translator with Configurable Voltage Supplies and Signal Levels and 3-STATE Outputs and Independent Direction Controls

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Overview

The FXL2TD245 is a configurable dual-voltage-supply translator designed for both uni-directional and bi-directional voltage translation between two logic levels. The device allows translation between voltages as high as 3.6V to as low as 1.1V. The A Port tracks the VCCA level, and the B Port tracks the VCCB level. This allows for bi-directional voltage translation over a variety of voltage levels: 1.2V, 1.5V, 1.8V, 2.5V, and 3.3V. The device remains in 3-STATE until both VCCs reach active levels allowing either VCC to be powered-up first. Internal power down control circuits place the device in 3-STATE if either VCC is removed. The Transmit/Receive (T/<span style="text-decoration: overline">R</span>) input determines the direction of data flow through the device. The <span style="text-decoration: overline">OE</span> input, when HIGH, disables both the A and B Ports by placing them in a 3-STATE condition. The FXL2TD245 is designed so that the control pins (T/<span style="text-decoration: overline">R</span> and <span style="text-decoration: overline">OE</span>) are supplied by VCCA.

  • This product is general usage and suitable for many different applications.

  • Bi-directional interface between any 2 levels from 1.1V to 3.6V
  • Fully configurable: Inputs track VCC level
  • Non-preferential power-up sequencing; either VCC may be powered-up first
  • Outputs remain in 3-STATE until active VCC level is reached
  • Outputs switch to 3-STATE if either VCC is at GND
  • Power-off protection
  • Control inputs (T/Rn, OE) levels are referenced to VCCA voltage
  • Packaged in the Chipscale MicroPak10 (1.6mm x 2.1mm)
  • ESD protection exceeds: 鈥� 4kV HBM ESD (per JESD22-A114 & Mil Std 883e 3015.7) 鈥� 8kV HBM I/O to GND ESD (per JESD22-A114 & Mil Std 883e 3015.7) 鈥� 1kV CDM ESD (per ESD STM 5.3) 鈥� 200V MM ESD (per JESD22-A115 & ESD STM5.2)

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FXL2TD245L10X

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CAD Model

Pb

A

H

P

UQFN-10

523AZ

1

260

REEL

5000

Y

2

CMOS

1.1

3.6

3.5

24

$0.1564

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Reliability Data

Die Related Summary Data

Device: FXL2TD245L10X

Equivalent to wafer fab process: CMOS SUB

Product Technology

Product Technology

Equivalent Device-Hours

MTBF/MTTF in Hours

FITS

CMOS SUB

2

920154574

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Re-calculate Data

Data is based on the following assumptions.

Note: The temperature and confidence level may be adjusted to your requirements.

Disclaimer: A reliability FIT rate calculated using this tool shall not be used for any functional safety purpose. In case a raw FIT rate needs to be estimated for a component which is targeted to be used in a safety critical application (i.e. compliant to ISO 26262 standard) it should be calculated according to generic safety standards (IEC62380, IEC61709, SN29500, FIDES, etc.)

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